โšก Electrical ยท 8 min read

Grounding and Bonding System Design per PEC Article 2.50

Grounding and bonding are routinely confused on estimates. They are three separate systems with separate purposes and separate sizing tables.

Three distinct functions

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The grounding electrode system

Use all electrodes present: ground rods (typically 16 mm × 3 m copper-clad, two rods 1.8 m apart), concrete-encased electrode (rebar in the footing), metal water pipe, and building steel. A single made electrode that cannot achieve 25 Ω or less must be supplemented by a second electrode.

Sizing the grounding electrode conductor (GEC)

Largest service conductor (copper)GEC (copper)
≤ 30 mm²8 mm²
38โ€“50 mm²14 mm²
60โ€“100 mm²22 mm²
125โ€“175 mm²30 mm²

The GEC to a ground rod need not be larger than 14 mm² copper regardless of service size.

Equipment grounding conductor (EGC)

Sized from the rating of the overcurrent device ahead of the circuit, not from the phase conductor:

OCPD ratingEGC (copper)
15โ€“20 A3.5 mm²
30โ€“60 A5.5 mm²
100 A14 mm²
200 A22 mm²

If phase conductors are upsized for voltage drop, increase the EGC proportionally by area.

Main bonding jumper

Connects the neutral bar to the enclosure at the service only (never downstream). Size it like the GEC for the service conductor size.

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